PV04200 - SEMI PV42 - Test Method for In-Line Measurement of Waviness of PV Silicon Wafers by a Light Sectioning Technique Using Multiple Line Segments Revision:SEMI PV42-0113 - Superseded SEMI G18-89 (technical revision)

SEMI G18-89 (technical revision)

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This procedure involves measurement of total Cr/Fe ratios

This Safety Guideline applies to the EHS training of personnel servicing

PV04200 - SEMI PV42 - Test Method for In-Line Measurement of Waviness of PV Silicon Wafers by a Light Sectioning Technique Using Multiple Line Segments Revision:SEMI PV42-0113 - Superseded SEMI G18-89 (technical revision)Si wafers for PV applications cut from a Si ingot or Si brick by multiple wire sawing contain surface undulations ripples characteristic for this cutting process, so called waviness. This waviness is a surface feature where the peaks and valleys of the waves are parallel to the wires of the saw and the direction of the wave is perpendicular to those wires. Waviness may significantly impact the quality of solar wafers. Waviness is frequently specified