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SEMI HB1 — Specifications for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
This Test Method may be used to characterize molding compounds in development
1-0708 (technical revision)
one of the package types
SEMI E84-0303 (technical revision)
M04500 - SEMI M45 - Specification for 300 mm Wafer Shipping System Revision:SEMI M45-1110 (Reapproved 0817) - Current SEMI HB1 — Specifications forThis Standard was technically approved by the Silicon Wafer Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 16, 2017. Available at www. semiviews. org and www. semi. org in August 2017; originally published March 2001; previously published November 2010. This Standard stipulates transport related materials and systems to minimize the total cost relating to transport of 300 mm
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US$ 2001.97
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